● Thermal conductivity coefficient 1.0-13 W/(m · K), optional single component oxime removal

● Good thixotropy, fast deep curing

● Resistant to yellowing, high temperature and high humidity

● Certified by TUV and SGS

● Good sealing performance, good adhesion to materials such as metal, glass, PPO, PA, etc

Encapsulation of solar cells, sealing of photovoltaic module frames, bonding of junction boxes and backplates, sealing of busbars, and sealing of module rails. Provide various solutions such as sealing, fixing, thermal management, and protection for solar cell modules and inverters.